AI Infrastructure Leaderboard
Track the companies building AI data centers, layer by layer: who is raising money, who is hiring, which standards bodies they work in, what they patent, and where public capital and grants are going. Every figure links to its source and shows the date we captured it.
The PECC 2026 edition covers the interconnect and photonics layer in full, plus optical compute and photonics assembly and test equipment from other layers, published for the Optica Photonic-Enabled Cloud Computing summit on October 20 and 21, 2026.
Companies: PECC 2026 edition: photonics and interconnect
Loading companies
| Company | Layer and segment | Private funding (Form D) | Hiring | Standards and consortia | Grants | Patents, last 24 months |
|---|
Where the money is going
Capital spending, private funding and grants
Capital expenditure, latest four reported quarters
Cash paid for property and equipment as each company reports it to the SEC. This is total spending, not only AI data centers, and it excludes assets taken on through finance leases.
| Company | Four quarters | Latest quarter | Source |
|---|---|---|---|
| Amazon Web Services | $173.0B | $54.2B to Jun 30, 2026 | AMAZON COM INC, Oct 15, 2026 |
| $132.4B | $44.9B to Jun 30, 2026 | Alphabet Inc., Oct 15, 2026 | |
| Microsoft | $115.9B | $35.8B to Jun 30, 2026 | MICROSOFT CORPORATION, Oct 15, 2026 |
| Meta | $89.3B | $30.1B to Jun 30, 2026 | Meta Platforms, Inc., Oct 15, 2026 |
| Oracle | $75.7B | $28.5B to Aug 31, 2026 | Oracle Corporation, Oct 15, 2026 |
| CoreWeave | $20.6B | $6.42B to Jun 30, 2026 | CoreWeave, Inc., Oct 15, 2026 |
| Applied Digital | $4.69B | $2.07B to Aug 31, 2026 | APPLIED DIGITAL CORPORATION, Oct 15, 2026 |
| TeraWulf | $2.23B | $855.6M to Jun 30, 2026 | TERAWULF INC., Oct 15, 2026 |
| Core Scientific | $1.48B | $565.0M to Jun 30, 2026 | Core Scientific, Inc./tx, Oct 15, 2026 |
| Cipher Mining | $1.23B | $410.3M to Jun 30, 2026 | Cipher Digital Inc., Oct 15, 2026 |
Fiscal quarters end on different dates for each company, so the four-quarter figures cover slightly different periods. A quarter is taken from the reported year-to-date amount less the prior year-to-date amount when no three-month figure is filed.
Private funding by layer
Amount sold in SEC Form D offerings filed since Oct 15, 2024, for companies with a reviewed SEC lookup. Companies that raise outside US private placements do not file a Form D, so this is a floor, not a market total.
| Layer | Amount sold | Filers | Reviewed lookups |
|---|---|---|---|
| Compute | $31.3M | 2 | 34 of 37 |
| Memory and packaging | $40.3M | 1 | 10 of 12 |
| Interconnect and photonics | $1.25B | 10 | 170 of 174 |
| Power | No filings | 0 | 21 of 22 |
| Cooling and thermal | $65.0M | 1 | 18 of 18 |
| Facilities and developers | $6.99B | 2 | 21 of 24 |
| Operators and demand | No filings | 0 | 19 of 19 |
| Enablers | $4.2M | 1 | 68 of 71 |
Grants to indexed companies
Grant totals count only companies in this leaderboard. An award is attached to a company by its own website address or by a recipient name we reviewed, never by a similar name.
Companies with the most public signals, by layer
Up to 10 companies per layer, ranked by how many signals we found for them (a Form D filing, a public job board, standards memberships, grants and patents), then by Form D amount sold. The full table for every layer is below.
Compute (37 companies)
- IntelAccelerators and processors
- PsiQuantumOptical and quantum compute
- AMDAccelerators and processors
- Microchip TechnologyAnalog and mixed-signal semiconductors
- NVIDIAAccelerators and processors
- Texas InstrumentsAnalog and mixed-signal semiconductors
- FuriosaAIAccelerators and processors
- ArmAccelerators and processors
- d-MatrixAccelerators and processors
- Dell TechnologiesServers and systems
Memory and packaging (12 companies)
- GlobalFoundriesFoundry and advanced packaging
- Micron TechnologyMemory and storage
- Samsung SemiconductorMemory and storage
- KioxiaMemory and storage
- Amkor TechnologyFoundry and advanced packagingNo signal captured yet
- SK hynixMemory and storageNo signal captured yet
- SolidigmMemory and storage
- TSMCFoundry and advanced packagingNo signal captured yet
- ASE Technology HoldingFoundry and advanced packagingNo signal captured yet
- IbidenFoundry and advanced packagingNo signal captured yet
Interconnect and photonics (174 companies)
- LightmatterOptical interconnect and CPO
- NokiaNetworking silicon and systems
- Cornelis NetworksNetworking silicon and systems
- AttoTudeOptical interconnect and CPO
- Point2 TechnologyElectrical interconnect and SerDes
- AdtranNetworking silicon and systems
- AmphenolConnectors, fiber and cable
- Arista NetworksNetworking silicon and systems
- Astera LabsElectrical interconnect and SerDes
- BroadcomNetworking silicon and systems
Power (22 companies)
- ABBElectrical equipment and distributionNo signal captured yet
- Bloom EnergyOn-site power and storage
- Delta ElectronicsElectrical equipment and distribution
- Fluence EnergyOn-site power and storage
- GE VernovaGeneration and fuel
- Kairos PowerGeneration and fuel
- OkloGeneration and fuel
- Talen EnergyGeneration and fuel
- VistraGeneration and fuel
- X-energyGeneration and fuel
Cooling and thermal (18 companies)
- JetCool TechnologiesLiquid cooling
- AccelsiusLiquid cooling
- BoydThermal management and HVAC
- Carrier GlobalThermal management and HVAC
- Johnson ControlsThermal management and HVAC
- SubmerLiquid cooling
- Trane TechnologiesThermal management and HVAC
- AsetekLiquid coolingNo signal captured yet
- Asia Vital Components (AVC)Thermal management and HVACNo signal captured yet
- Auras TechnologyThermal management and HVACNo signal captured yet
Facilities and developers (24 companies)
- CrusoeNeoclouds and GPU clouds
- FluidstackNeoclouds and GPU clouds
- Aligned Data CentersData center developers and operators
- Cipher MiningData center developers and operators
- CoreWeaveNeoclouds and GPU clouds
- CyrusOneData center developers and operators
- Galaxy DigitalData center developers and operators
- LambdaNeoclouds and GPU clouds
- NebiusNeoclouds and GPU clouds
- NscaleNeoclouds and GPU clouds
Operators and demand (19 companies)
- ByteDancePlatform and consumer technology
- GoogleHyperscalers and cloud providers
- MetaHyperscalers and cloud providers
- MicrosoftHyperscalers and cloud providers
- OracleHyperscalers and cloud providers
- TencentHyperscalers and cloud providers
- Alibaba GroupHyperscalers and cloud providers
- AnthropicAI labs
- China TelecomTelecom network operators
- FiberCopTelecom network operators
Enablers (71 companies)
- KeysightTest and measurement
- Viavi SolutionsTest and measurement
- Cadence Design SystemsEDA and design software
- EXFOTest and measurement
- JabilManufacturing services
- MultiLaneTest and measurement
- SiemensEDA and design software
- SynopsysEDA and design software
- Teledyne LeCroyTest and measurement
- ThintronicsMaterials
How each figure is collected
Private funding. We look up each company in SEC EDGAR and accept an entity only when its name matches exactly and its trading symbol, address or filings confirm it is the company. Offerings filed since Oct 15, 2024 are summed at their latest amended amount sold. "No Form D found" means EDGAR has no entity under the company's name; it is never shown as zero funding.
Hiring. We count roles only on a job board that the company's own careers page links or loads. A company without one shows "No linked job board found". That says nothing about whether it is hiring: many companies use careers systems without a public listing feed.
Standards and consortia. Captured from the public member lists of OIF, the LPO MSA and the Ultra Ethernet Consortium, matched by the website each list links or by exact name. Open Compute Project, UCIe and CW-WDM MSA lists are not yet included. A company a later list omits stays shown as previously listed.
Grants, patents and capital spending. CHIPS for America awards from NIST award pages, SBIR and STTR awards from SBIR.gov, Horizon Europe participations from EU CORDIS, US patents and published applications from the USPTO Open Data Portal by exact applicant name and the CPC classes of each layer, and capital expenditure from SEC XBRL filings.
| Source | Status | Captured | Rows read |
|---|---|---|---|
| Company public job boards | Captured | Oct 15, 2026 | 63 |
| CHIPS for America awards | Reviewed list | Oct 15, 2026 | 20 |
| EU CORDIS Horizon Europe projects | Captured | Oct 15, 2026 | 148,155 |
| CW-WDM MSA members | Not yet included | not captured | |
| LPO MSA members | Captured | Oct 15, 2026 | 47 |
| Open Compute Project membership directory | Not yet included | not captured | |
| OIF member companies | Reviewed list | Oct 15, 2026 | 175 |
| Prospectory reviewed company seed list | Reviewed list | not captured | |
| SBIR.gov awards | Captured | Oct 15, 2026 | 219,649 |
| SEC EDGAR Form D filings | Captured | Oct 15, 2026 | 377 |
| SEC XBRL company facts | Captured | Oct 15, 2026 | 10 |
| UCIe Consortium members | Not yet included | not captured | |
| Ultra Ethernet Consortium member links | Captured | Oct 15, 2026 | 93 |
| USPTO Open Data Portal | Coming soon | not captured |
Snapshot generated Oct 15, 2026. Company-level public data only; no personal data is collected.